ISO/TS 10303-1647:2019 specifies the application module for Assembly physical interface requirement.
The following are within the scope of ISO/TS 10303-1647:2019:
- mating connector location;
- design volume description;
- physical protocol layer description including connector pinout mapping to signal names;
the representation of the information needed to describe the manner by which an electronic assembly shall mechanically interface to the next higher assembly. The type of mating connector and its location relative to the electronic assembly are provided as a design requirement, that must be satisfied in the design. The module includes representation of the information needed to describe a physical layer of a communication protocol at a connector interface level.
Status : PublishedPublication date : 2019-11
Edition : 4Number of pages : 11
Technical Committee:Industrial data