The following parts of ISO 9455 have been revised and published in August 2017:
- part 11, Solubility of flux residues
- part 13, Determination of flux spattering
- part 14, Assessment of tackiness of flux residues
- part 15, Copper corrosion test.
Note that a revision of part 3, Determination of acid value, potentiometric and visual titration methods is under preparation.
To read the scope of each part, click here !
Scopes:
- Part 11, Solubility of flux residues, specifies a qualitative method for assessing the solubility of flux residues in a selected solvent. The method is applicable to all fluxes of Type 1, as defined in ISO 9454‑1.
- Part 13, Determination of flux spattering, specifies a method for estimating the tendency of a flux to spatter in use. It is a qualitative (comparative) method and is only applicable to liquid fluxes, as defined in ISO 9454‑1.
- Part 14, Assessment of tackiness of flux residues, specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.
- Part 15, Copper corrosion test, specifies a qualitative method for determination of the corrosive properties of flux residues on a copper substrate when subjected to controlled environmental conditions. The test is applicable to type 1 fluxes, as defined in ISO 9454‑1.