ISO/TS 10303-1649:2019 specifies the application module for Assembly technology.
The following are within the scope of ISO/TS 10303-1649:2019:
- bonds between components in an assembly;
- bond shape definition;
- bonds based on solder or adhesive;
- bonds based on discrete fasteners;
- component mating conditions characterization.
the representation of the information needed to describe the different aspects of how components are joined together to make an assembly. This module defines the information needed to describe the material used in making the physical connections and their typical shape. This module is foundational for verification and validation that the actual design meets detailed functional specifications by providing a mechanism for a design organization to make explicit assertions about the detailed joints that are implemented in the physical design.
Status : PublishedPublication date : 2019-11
Edition : 5Number of pages : 11
Technical Committee:Industrial data