ISO/TS 10303-1716:2018-11 specifies the application module for Layered interconnect complex template.
The following are within the scope of ISO/TS 10303-1716:2018-11:
- footprint definition;
- footprint definition shape;
- padstack definition;
- padstack definition shape;
- items within the scope of application module Layered interconnect simple template, ISO/TS 10303-1718;
- items within the scope of application module Physical unit 2d shape, ISO/TS 10303-1726.
Status : PublishedPublication date : 2018-11
Edition : 5Number of pages : 11
Technical Committee:Industrial data
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This collection is the standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …