ISO/TS 10303-1682:2018-11 specifies the application module for Interconnect 2D shape.
The following are within the scope of ISO/TS 10303-1682:2018-11:
- embedded physical component location;
- continuous planar feature shape definition.
Status : PublishedPublication date : 2018-11
Edition : 5Number of pages : 11
Technical Committee:Industrial data
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This collection is the standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …