ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
Status : PublishedPublication date : 2002-12
Edition : 1Number of pages : 21
Technical Committee:Soldering materials
Buy this standard
A standard is reviewed every 5 years
Revisions / Corrigenda
Now under review