This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.
Status: PublishedPublication date: 2023-01
Edition: 1Number of pages: 12
Technical Committee: ISO/TC 206 Fine ceramics
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