Abstract Preview

ISO 16525-9:2014 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board. It also investigates the characteristics of wiring with an isotropic electrically conductive adhesive, which can be applied on to the printed circuit board.

General information

  • Status :  Published
    Publication date : 2014-05
  • Edition : 1
    Number of pages : 45
  • :
    ISO/TC 61/SC 11
  • 83.180

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