This standard was last reviewed and confirmed in 2019. Therefore this version remains current.
ISO 16525-9:2014 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board. It also investigates the characteristics of wiring with an isotropic electrically conductive adhesive, which can be applied on to the printed circuit board.
Status : PublishedPublication date : 2014-05
Edition : 1Number of pages : 45
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