This International Standard applies to physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10 Mbit/s to 200 Mbit/s and at 1 Gbit/s in copper and optic technologies (as developed in Open Microprocessor Systems Initiative/Heterogeneous InterConnect Project (OMI/HIC)).
The object of this International Standard is to enable high-performance, scalable, modular, parallel systems to be constructed with low system integration cost; to support communications systems fabric; to provide a transparent implementation of a range of high-level protocols (communications, e.g. ATM, message passing, shared memory transactions, etc.), and to support links between heterogeneous systems.
Status: PublishedPublication date: 2000-07
Edition: 1Number of pages: 162
Technical Committee: ISO/IEC JTC 1/SC 25 Interconnection of information technology equipment
- ICS :
- 35.160 Microprocessor systems
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|std 2 208||Paper|
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Stage: 90.93 (Confirmed)
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