ISO 4746:1977 Preview
Oxygen-free copper -- Scale adhesion test
This standard was last reviewed and confirmed in 2013. Therefore this version remains current.
Provides a means of assessing the usability in electronic devices, for applications involving glass-to-metal seals, or other uses relying on the formation and presence of an adherent film of copper oxide. The procedure includes preparation and heating in air of a test piece, followed by rapid cooling in water and visual examination for loss of the oxide film or blistering.
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